Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Tue Feb 04 08:32:49 EST 2003 | roertner
In my experience AOI's are good for checking machine setup I.E. first piece inspection. After that the only things they will typically catch are wrong parts, reversed parts, missing parts, and tombstones. I would however suggest getting an AOI with a
Electronics Forum | Wed Apr 02 09:56:59 EDT 2008 | patsama_n
Every time to create new AOI program we must manual set at bright lighting level for each component. then this case we think the parameter of AOI setting it not concern for this problem due to the golden board that we use to confirm machine before st
Electronics Forum | Thu Dec 16 15:06:32 EST 2010 | rway
I would go with AOI. Reasons are: --AOIs are faster --They have more coverage. Given, you cannot test the value of components, but the AOI will ensure that all resistors are correct, orientation of ICs are proper and components are present on the
Electronics Forum | Mon Jul 24 22:50:43 EDT 2017 | dawson
In fact, we can solve this problem easily. AOI only check whether the IC is soldered well. But we can ask our technician to make a test first to control the reflowing temperature and time. 1. using tool to test the temperature between the bottom IC
Electronics Forum | Mon Jun 11 04:39:29 EDT 2012 | buckcho
Hello to everyone! I am making another discussion about AOI. I hope I posted in the right sub-forum.I read all the other threads and I have some questions. My company wants to byu a new post reflow AOI machine and they have selected these brands - Om
Electronics Forum | Thu Nov 19 14:38:49 EST 2009 | doremi
Oh, my dear, printer is just a part of the full picture. Without good and stable pick and place what if the printer is excellent???It is all important - printer, solder paste,stencil,P&P,oven,AOI and of course good process engineers or whatsoever are
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
Electronics Forum | Thu Apr 22 11:04:58 EDT 1999 | Boca
| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
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