Electronics Forum | Fri Aug 03 17:00:57 EDT 2001 | mparker
Start with a definition of what you expect the AOI to achieve at each station. Will your in-line machine be post print? Place (pre-reflow) or post reflow? Rather than buy one very expensive machine to put at the end of the line, maybe a couple of
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Wed Mar 24 12:54:02 EDT 2010 | davef
Ignore the defect * Late 1990s to early 2000s => ICT * Early 2000s to mid-2000s => MDA * Mid-2000 on-ward => AOI
Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager
When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the
Electronics Forum | Mon Aug 27 08:16:23 EDT 2012 | rway
No, in his case an ICT in not out of the question. An ICT, especially with many passive components, can give you piece of mind that the assembly was built correctly. Even with the addition of an automated insertion machine, you still run the risk o
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
Electronics Forum | Mon Aug 27 08:29:28 EDT 2012 | cobham1
The process is currently being performed by hand. I am trying to automate the process by switching to pick and place equipment and using AOI. Problem number one is getting my customer to sign off on switching from hand assembly to machine assembly.
Electronics Forum | Mon Aug 27 08:36:52 EDT 2012 | rway
The process is currently being performed by hand. > I am trying to automate the process by switching > to pick and place equipment and using > AOI. > > Problem number one is getting my customer > to sign off on switching from hand assembly to >
Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca
| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci
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