Electronics Forum | Fri Jul 13 14:56:01 EDT 2001 | stevenamacdonald
One of our board vendors recently switched their stencil design to home plate apertures. Since the change the quality and yield of their PCB's has went south, Could this process change be the cause?
Electronics Forum | Mon Jul 16 14:38:22 EDT 2001 | ohboy
If your pad designs don't meet IPC recommendations, using home plate may have adversely affected the (possibly marginal) placement tolerances. This could also be caused by an incorrect home plate design, which IPC has also given recommendations for,
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Mon Apr 16 09:13:16 EDT 2007 | pjc
Tombstone head and a graveyard mind. I would not recommend 1:1 due to solderpaste beed out opportunities. Have you tried the inverted home-plate? Here are some good links on tombstoning and how to eliminate it: http://www.aimsolder.com/technical_ar
Electronics Forum | Fri Sep 09 11:37:27 EDT 2005 | ???
Try home-plated the stencil apertures, and make "V" shape home-plated outside edges of two pads instead of between two pads.
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
Electronics Forum | Fri Sep 09 14:03:06 EDT 2005 | Mei
Nomorely the V-shape home-plated apertures look like two opening mouth facing each other. But this time just opposite way. And make 30% home-plated. Hope you can understand.
