Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto
I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal
Electronics Forum | Tue Sep 14 13:27:57 EDT 1999 | Scott S. Snider
| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol
Electronics Forum | Fri Sep 17 09:44:26 EDT 2004 | davef
We agree with Russ. * Haven't used them in 10+ years. * Size of keepout for the stepped apertures needs to be large. * Manipulating aperure size to manage paste volume for specific components is not difficult.
Electronics Forum | Wed Sep 19 13:43:49 EDT 2001 | jschake
I cannot report having experience with 0201 printing applications on flex circuits. Generally, I would be concerned with handling of the flex substrate. A carefully designed vacuum capable custom tooling fixture would likely be required to ensure p
Electronics Forum | Tue Sep 24 12:49:43 EDT 2002 | dragonslayr
Aperture reduction @ 5 mils thickness is your best bet. It may take several attempts to get just the right paste volume. What aperture reduction was specified to the stencil house for these specific LEDS? or was the stencil blindly produced using a
Electronics Forum | Thu Jan 06 21:41:20 EST 2005 | James Khor
You can using Ersa IR550A Rework System. The unit was NOT using any hot air process. IR550A Rework System is worldwide the only system with a genuine closed loop control system. Which employs the current temperature at the component in order to regul
Electronics Forum | Thu May 24 17:37:25 EDT 2007 | jmelson
I did one batch of low-density (0805 and standard SO chips) with excellent results. I then spent some time figuring out how to calibrate the mechanical alignment station (most of the calibration offsets on this machine were either zero or several mm
