Electronics Forum | Fri Aug 27 13:31:47 EDT 1999 | swsng
1.5 FATOR FOR 20MILS QFP REDUCE 2 MILS HEEL AND INCREASE 2MIL AT TOES AT SIDES -1MILS EACH. SWSNG
Electronics Forum | Mon Apr 14 17:41:21 EDT 2008 | janz
Hello, That is working for us. If you have a look at the Indium or Cookson recommendation they are very similar. Just make few diffrent patterns of the BGA and find out what is workin for you. Regards Jan
Electronics Forum | Tue Apr 20 20:10:16 EDT 2004 | Indy
Hi Everyone, I am trying to stencil print chipbonder. The problem I am having is with the cleaning of stencil. The apertures are gettting blocked and cleaning with alcohol is not helping. Could anyone suggest a better way of cleaning the stencil. I
Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon
| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co
Electronics Forum | Wed Feb 20 19:59:10 EST 2008 | pnguyvu
An experienced stencil designer suppose to check gerber data before making stencil it take 5 minutes to do this easily in computer after that analyze components if there's any critical parts in order to modify the aperture at USA STENCILS INC we have
Electronics Forum | Thu Feb 08 15:47:08 EST 2007 | realchunks
We use 1 to 1 aperture on a 6 mil stencil, no problems. Do not over print unless your board resist allows you too.
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Wed Aug 25 15:51:58 EDT 1999 | JohnW
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef
STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
