Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Mon Oct 15 12:42:36 EDT 2001 | davef
I hate getting "roped" into math stuff, but here I go again ... Area of aperture = volume of paste / stencil thickness = {[5000 mil^3] / 5 mil} = 1000 mil^2 Side of the square aperture = Sqrt of the area = [1000 mil^2]^1/2 = 32 mil Diameter of ape
Electronics Forum | Fri Jul 05 11:45:47 EDT 2002 | stefwitt
I have seen the U-shaped aperture on a customer site, being used with success. However, the problems with the stencil and the �loose� tabs where reportedly a reason to search for different aperture designs. Before this company could test their ideas
Electronics Forum | Wed Apr 27 13:17:14 EDT 2005 | grantp
Hi, That was one of the recommendations made when I had the problem, but I never followed it up. Would the outside corners of the square aperture be on the edge of the pad, so you would be putting down less paste on a smaller aperture, but it's sq
Electronics Forum | Thu Nov 03 05:55:34 EDT 2016 | lachrymal
Hi, I am struggling to interpret correctly the following statement: "An aperture oriented with its long axis in the same direction as the blade stroke does not fill as well as an aperture oriented with its short axis to the blade stroke." If I a
Electronics Forum | Tue Mar 21 16:25:23 EST 2000 | Boca
Full radius corners on pads can help with solder paste release in the stencil. The radius shape minimizes the surface area in the wall of the stencil aperture as compared to a sharp corners. When the stencil is seperating from the pcb the solder pa
Electronics Forum | Fri Dec 17 18:31:29 EST 1999 | Calvin Wong
One thing we found out when we did new stencil is this, you reduce the stencil aperture by 10% is actually based on the Gerber. Please note also that the PCB supplier also makes the PCB according to the Gerber and there is a reduction on the pads as
Electronics Forum | Thu Jun 03 17:24:03 EDT 1999 | Steve A
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al | Hey Al, An Electroformed (an additive process) stencil is comparable quality wise as a laser
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
