Electronics Forum | Fri Oct 22 07:35:02 EDT 2004 | davef
Most glue suppliers recommend chemicals and methods for removing the product from stencils. What does yours suggest? Further, search the fine SMTnet Archives for background discussion.
Electronics Forum | Wed Mar 20 19:58:59 EST 2002 | davef
You based the aperture size on LxBxH. Where did you get the LxBxH? Obviously the thickness of the stencil is kinda fixed. Who gave you the other numbers? Consider searching the fine SMTnet archives for background on aperture design.
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Wed Jul 14 08:00:01 EDT 2004 | davef
Bags of sand might work. For background discussions on this approach, search the fine SMTnet Archives on: bag* and wave
Electronics Forum | Tue Nov 07 07:55:43 EST 2006 | davef
We use J-STD-001, a widely accepted consensus document, control limits of 18-30*C, 30-70%RH. Search the fine SMTnet Archives for background.
Electronics Forum | Tue Dec 13 22:25:29 EST 2005 | davef
Kathy-Sunnyvale We've talked about Mydata machines quite abit here on SMTnet. Search the fine Archives for background discussion.
Electronics Forum | Tue Oct 31 22:09:25 EST 2006 | davef
The is a serious concern of lead contamination of leadfree solder connections. For background, search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=30307
Electronics Forum | Wed Jan 05 11:11:09 EST 2000 | Dave F
Hey Pat: My responses are: 1. Does anyone have experience with the shelf life on immersion white tin? If so, how long can the boards be stored without adversely affecting solderability. I've heard one year. No, we don�t, because we turn boards fa
Electronics Forum | Mon Aug 14 21:57:53 EDT 2006 | davef
For background, look here: * http://www.merix.com/technology.php?section=papers&page=pdf/surface_finish_aug_2002.pdf * http://www.empf.org/empfasis/2006/mar06/lfconversion.html * http://www.omnigraph.com/index1.html?content=/subpages/articles/whit
Electronics Forum | Tue May 28 08:31:49 EDT 2002 | Hussman69
Hello, I know I will probably get a dozen "check the archives" answers, but what the heck. What is YOUR typical polarity mark for SMT devices? Do you use silk screen or cut a corner off a pad? Let me know and thanks.
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