Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Thu Jun 09 20:48:07 EDT 2016 | deanm
I'm assuming these are two leaded axial components. GPD Global makes fluid dispensing and component prep equipment. Component leads can be formed (or bent) in order to provide some resistance in the hole during insertion. This should prevent the comp
Electronics Forum | Fri Jul 23 09:01:36 EDT 1999 | Earl Moon
| HI Earl | Thank you for your answer. | Let me know you about the hot you mentioned | First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) | ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED
Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Tue Dec 15 17:01:36 EST 1998 | Chrys
| Does anyone know what a TCP is? | What type of process is required for assembly, what type of equipment? | | Any help or resources on the subject would be greatly appreciated.. | | Thanks | Brain, TCP, or tape carrier package is the same as TAB
Electronics Forum | Fri Nov 27 08:07:50 EST 1998 | Earl Moon
| | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M
| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure
Electronics Forum | Sat Sep 12 10:47:00 EDT 1998 | Jon Medernach
I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dime
Electronics Forum | Wed Nov 11 06:59:20 EST 1998 | Jim Mitchell
Scott - Good to see things are going well for you. With regard to your comments, Quad has introduced a complete line of Semi-conductor/APT machines (Q Series) that support both SMT and Semi-conductor applications. The machines were introduced in 19
