Electronics Forum | Wed May 22 12:32:49 EDT 2002 | pwrgroup
which stencil vendor can deliver aspect ratio and area ratio and the statistical information to the user?It's difficult if the pad is modified.
Electronics Forum | Fri May 17 11:10:25 EDT 2002 | wister
Is there any software to design the stencil openings? It may be including automatic modify the aperture,monitoring aspect ratio and area ratio,even let you know the whole vloume of the opening and average ratio?because the stencil design is more impo
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef
Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Tue Oct 24 15:05:31 EDT 2000 | Steve Thomas
Maybe someone has a good explanation for this, but I'm wondering why your customer would dictate the equipment you use in your process. I thought typically contracts define the quality standards and you decide how to get there....show's you what I k
Electronics Forum | Tue Oct 24 19:50:34 EDT 2000 | Dave F
In response to your questions: * Will a polyurethane squeegee blade help? NO * Will a Pro-Flow head help? NO, but it might be a cool excuse to buy one. Unfortunately, you will look like a jerk, if you talk your boss into buying one and then he /
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Sat Mar 31 08:22:42 EDT 2007 | davef
Are you observing stencil design rules with regard to aspect and area ratios? For more: * IPC-7525 - Stencil Design Guidelines * A previous discussion http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24848 * Other postings on stencil ratio
