Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
Electronics Forum | Tue Apr 04 10:18:58 EDT 2000 | Russ
Brian, I agree with Jesper, You seem to have a PCB supplier problem! The conditions that you are processing your assembly with are nothing unusual and in fact very standard throughout all of the manufacturing facilities that I have been in, unless
Electronics Forum | Fri Mar 24 13:02:53 EST 2000 | Ashok Dhawan
Two questions on ESD: 1. What is recommended method ( Air ionizer , grounding strip etc. ) for a board prep ? We Kapton Tape for masking pads or not to be soldered areas. or Is there a wet mask recommended for masking boards campatible with NC Sold
Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko
Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s
Electronics Forum | Fri Feb 18 09:41:44 EST 2000 | James Lewis
Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture
Electronics Forum | Tue Feb 06 18:12:46 EST 2001 | davef
Pete makes great points. Taking a slightly different angle, use your placement equipment's software to help you. It keeps track of the number of picks and attempts for each location. Study these numbers for a week and determine the capability of p
Electronics Forum | Mon Feb 26 14:39:34 EST 2001 | John
We are developing a new product that will have hand placed through hole parts and double sided smt. This assembly will eventually be soldered to a plastic cover that has 15 insert molded terminals. The cover extends below the surface of the board,
Electronics Forum | Tue Feb 27 18:10:55 EST 2001 | davef
I�m unclear about � "BB training"??? "BB candidates"? Is BB [Box-??] [Bhote-??] a Design Of Experiments technique like Taguchi? As a start, the following affect the "attrition rate": * Assembly machine program * Machine calibration and maintenan
Electronics Forum | Wed Feb 28 19:48:11 EST 2001 | davef
If we were talking about a single board problem, we�d be thinking about the laminate, but since you imply the problem is broad-based across multiple assemblies, consider the following machine parameters: * Crank-up preheat time / temperature to driv
Electronics Forum | Tue Mar 13 18:25:45 EST 2001 | slthomas
Anyone doing a print-dispense-place-reflow process? I've never heard of it being done this way before today. Don't know why, actually, as it sounds like a fairly friendly method provided the adhesives used are happy with a standard reflow profile.
