Electronics Forum | Mon Apr 17 18:42:32 EDT 2000 | Russ
Murad, I have just completed a switch over in our facility to no-clean. We used Alpha 609 and 857 paste and wave flux respectively. We currently use Alpha UP78 paste, NR330 wave flux, NR205 liquid flux for touchup and cleanline 7000 wire solder as
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Thu Jul 02 15:27:19 EDT 1998 | Justin Medernach
| | Looking to contact some users of Vitronics reflow ovens. | | Which model do you use? | | Overall opinion of equipment and company? | | Thanks in advance | Where in the world is Steve Dow when you need him? Steve was one of the pioneers at Vitroni
Electronics Forum | Wed Feb 25 12:55:23 EST 1998 | N.J Bateman
| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would
Electronics Forum | Wed Feb 25 12:55:15 EST 1998 | N.J Bateman
| | | I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would
Electronics Forum | Wed Aug 22 19:54:54 EDT 2001 | mkallen
Can anyone point me to a relevant IPC spec that specifies an allowable board stretch, measured between metal features on outer layers (e.g., between fiducials and component pads on the topside of a board)? I've got a non-linear stretch problem that'
Electronics Forum | Thu Sep 20 09:12:28 EDT 2001 | jschake
If you were successful in running the machine in dry cycle mode, then I would expect with new squeegees that the prints would be acceptable. To give you more tangible data on what you may expect from the actual print results, maybe you could run the
Electronics Forum | Tue Apr 01 11:50:08 EST 2003 | rdr
Dave, thanks for the info. This sounds like it would verify the presence of an open. We have verified that these balls are open and I am trying to figure out if we are fracturing or not wetting. causing these opens. I would use the die method on ne
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Thu Feb 12 15:32:15 EST 2009 | gtemkin
A few other data points to consider. My experience working with Dymax 984LVF material was that its UV cure must be initiated immediately after coating, otherwise is surface will remain tacky forever, something like a post-it note tackiness, which wi
