Electronics Forum | Tue Oct 09 14:59:52 EDT 2001 | slthomas
That's what we do with our MSHII's...setup one carriage offline while the other one runs. We also have setup carts to load the feeders ahead of time and haul them out to the lines. Of course, when we exceed the carriage capacity of 75 slots for an
Electronics Forum | Wed Oct 10 16:16:15 EDT 2001 | lisa
Hello all, I'm looking for some advice on inter-metallic formation. I have some circuit board finished with Immersion Tin, Immersion Silver and OSP. They have been reflowed with solder past and components,the joints look good. What can I expect fo
Electronics Forum | Tue Oct 16 17:18:25 EDT 2001 | lileubie
Hello Chua, Welcome to the world of SMT. You found this site, so you're already on track to learning about SMT. You can check out SMTnet's library as well as SMTA's (Surface Mount Technology Association) located at http://www.smta.org. Check that
Electronics Forum | Fri Oct 12 14:32:52 EDT 2001 | Mike Konrad
Hi, Maybe Yes� Maybe No� Actually, it most likely is acceptable to clean assembled boards in an ultrasonic cleaning system (40 kHz). There are some concerns in some circles about possible damage to wire bonds in components. There have been publi
Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas
We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.
Electronics Forum | Mon Oct 29 20:19:44 EST 2001 | davef
DON'T do it!!! The two problems you'll have are: 1 Poor manufacturing process control, resulting in weak solder connections. 2 Weak solder connections are stressed, when the board is straightened upon installation in the "box". There's several hits
Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker
I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O
Electronics Forum | Fri Nov 02 08:30:40 EST 2001 | fmonette
For double-side reflow boards, take note that if you have moisture-sensitive components on the first side, you will need to track their remaining floor life up to the final reflow. This is because the reflow process is too fast to effectively remove
Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef
Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of
Electronics Forum | Mon Nov 19 09:51:51 EST 2001 | MDion
Bonjour, Is there any study done about the effects of X-RAYs (INCLUDING Airports/Customs systems) on electronic assembly ?? We have had few problems with products recently where the programmed flash was not functionnal (corrupted data) when tested
