Electronics Forum | Wed Sep 29 12:17:03 EDT 2010 | swag
You might try assembly carrier tape such as Tacsil on your fixtures. Beware - arrays are very diffult to run in SMT flex unless you have no fine pitch.
Electronics Forum | Tue Mar 05 11:08:31 EST 2019 | mrk
Hi all, We have an assembly which features non-plated tooling holes used to align the board in a bed of nails style test fixture. This assembly is rather small, and as such, the test points are pretty small as well. We have found that some variation
Electronics Forum | Thu Dec 04 10:26:06 EST 2008 | billmeye
Is anyone aware of any white papers regarding the possibility of lead contamination on ROHS assemblies from using the same test fixture with the same test probes on both tin/lead and ROHS assemblies. We have customers switching over but we are still
Electronics Forum | Wed Mar 23 22:28:10 EST 2005 | KEN
I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.
Electronics Forum | Tue Jan 30 09:31:08 EST 2007 | russ
these assemblies getting depaneled? ICT? any fixtures or anything? I would check your print and placement equipment and make sure there are no support issues as well. But I believe you mentioned fractures so that would be happening after the reflow
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Tue Sep 07 16:49:49 EDT 2021 | davef
Talk to us more about your application. Are you talking about ICT test head fixturing or adding pogos to the board during assembly? Or ...
Electronics Forum | Tue Jul 31 22:06:12 EDT 2007 | davef
We had no problems reflowing an assembly on Bergquist Thermal Clad. The assembly was small. So, we built it on a 8-up fixture. It stayed in the fixture from screen print, through pick and place, and into reflow. When the fixture came out of the r
Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
Electronics Forum | Mon Oct 25 12:35:17 EDT 1999 | Steven Willett
I'm interested in anyones experience in simultaneous RF testing of multiple assemblies in a Continuous Flow Manufacturing (CFM) environment. Issues include board handling, shielding, fixture constuction and probing options.
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
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