Electronics Forum | Wed Mar 24 15:10:23 EST 2004 | davef
Without a proper picture, I'd reject the parts that you describe based on IPC-A-610, 7.2, which says words to the effect: Defect - Class 1,2,3 - Dirt and particulate matter on assembly, eg, dirt, lint, dross, metallic particles, etc. Absence or pres
Electronics Forum | Tue Jan 23 06:16:13 EST 2007 | Ayelet
Hi, I am lookinh for standards that define the cleanliness level of the assembly room and also for the test and packaging room. I understand that tehre are some defintions of tempertaure and humidity that shoudl be met. Are there any specs for part
Electronics Forum | Wed Feb 17 17:21:10 EST 1999 | Kiet D
I'm qualifying Ablebond 8360 from Ablestik for hybird circuit assembly. Anyone has experience with this epoxy. In my preliminary experiment with this epoxy, I had a seperation problem with a 30 gauge needle which we are using for dispensing 84-1LMIS.
Electronics Forum | Thu Oct 31 16:40:01 EST 2002 | dragonslayr
Steve- I was once an auto body repairman in an automotive assembly plant. We used lead for dent filler instead of bondo. It was much faster to use. No cure time like a plastic filler needs. Lead was absorbed through my skin from hand filing the lead
Electronics Forum | Thu Nov 04 07:01:43 EDT 2010 | clampron
Good Morning, I had looked into this several years ago. The Swiffer dust mops use static to capture and contain dust particles. That would make this a huge ESD concern. Electrical SMT equipment is grounded so any charge potential generated would be
Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt
Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Fri Oct 02 16:11:46 EDT 1998 | Benji
Hi Dave, In the first level packaging, people who work on the assembly floor must not wear make-up. In the old days when the requirements were not as strict as what it is these days, one good protection was to wear finger cots or surgical gloves. H
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
Electronics Forum | Fri Oct 02 16:49:33 EDT 1998 | Dave F
Benji: I tend to agree with you that assemblers shouldn't wear make-up. I'm unsure what first level assemblers are tho. I've been down that finger cot/glove route ... 1 If someone is going to smear facial or cosmetic oil on a board, they can do
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