Electronics Forum | Fri Jan 07 13:17:48 EST 2005 | bschreiber
3) There are several papers on the safety of cleaning PCBs and ICs using ultrasonic technology. The latest is in the October 2004 issue of SMT magazine by William Kenyon, "Why Not Ultrasonics?" Most of the studies have been performed by Dr. B.P. Ri
Electronics Forum | Mon May 12 13:55:19 EDT 2014 | hegemon
It sounds like a bit too much solder on the PWB, caused by too large a pad for the lead it will contain. In that case solder reduction is the way to move forward. What are the options there? 1. New stencil or stencils - (not desirable) 2. Increas
Electronics Forum | Tue Apr 19 13:23:33 EDT 2016 | vchauhan
We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes
Electronics Forum | Fri Aug 22 13:10:51 EDT 2008 | bschreiber
The folowing articles are available at: http://www.smartsonic.com/article.html "Why Not Ultrasonic Cleaning?" by William Kenyon "Damage-Free Ultrasonically-Assisted Cleaning of Printed Circuit Assemblies" - by B.P. Richards et al "Does Ultrason
Electronics Forum | Tue Apr 19 16:20:05 EDT 2016 | davef
Don't blame it on the poor paste thickness requirement [although I might go on to argue that it's could be a contributor to the issue]. Most likely you're the problem. About 70% of the time solder on gold fingers is caused by poor cleaning of screen
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