Electronics Forum | Mon Feb 14 21:01:15 EST 2000 | Thomas Ravener
IBM, Endicott, New York did extensive research on that. There was also some information I think that was published. You may want to contact Howard Manko of Manko & Associates. He's the soldering guru and has written many books on soldering & solderab
Electronics Forum | Mon Sep 13 10:55:44 EDT 1999 | K3 Equipment
| Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h
Electronics Forum | Wed Aug 22 17:00:51 EDT 2001 | Doug Chambers
I am researching articles with respect to intermetalics growth associated with gold as a final metalization. We are currently looking at a few options that include a 10uin flash followed by a 30uin selective and a total 30uin finish. The concern is
Electronics Forum | Tue Jan 08 17:29:20 EST 2002 | davef
Your research is on track. NC flux needs to reach activation temperature. Also, do not depend on the corrosion characteristics associated with the flux classification (ie, L1, L0, M1, M0, etc.), until the flux is activated by exposure to soldering
Electronics Forum | Sun Jul 21 08:36:42 EDT 2002 | davef
We know of no one like that, but angles to take in looking for this person might be: * 'Connector Specifier' Susan Woods 847-876-5602 * Ed Cady, Meritec, 888-637-4832 * Robert Mroczowski, ConnNtext Associates, 717-664-2246 * John Peel, Contech Resear
Electronics Forum | Mon Sep 13 12:19:42 EDT 1999 | Earl Moon
| | Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid-
Electronics Forum | Fri Apr 19 15:48:28 EDT 2002 | davef
I don�t know much about zinc either. I can tell you that zinc forms no intermetallics with lead. So, I�m not so sure that �diffusion� is the correct term. Of the following: * Hwang "Modern Solder Technology For � * Wassink "Soldering In Electronic
Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel
Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo
Electronics Forum | Thu May 20 11:55:04 EDT 1999 | Parvez
hi everybody, We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the micr
Electronics Forum | Wed Oct 31 12:37:28 EDT 2007 | jdengler
Hi aj, We recently purchased an AOI machine. While doing the first pass research to see which machines to put through a head to head competition I discovered a major improvement in the programming for newer machines. If you buy used, get one that
