Electronics Forum | Tue Aug 20 22:37:15 EDT 2002 | dwoon
I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control. How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting thi
Electronics Forum | Thu Dec 04 12:24:35 EST 2008 | jdumont
We have the same Asymtek machine, same Humiseal product, same bubbling issue on touch ups. Ive found that very light pressure and a thinner mixture usually yields good results for us. Generally I dip the brush in the mixture and let it drip near wher
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Fri Jun 12 17:26:48 EDT 2009 | sadamson
I'm not the Asymtek expert on this subject but you have to run a ROI study. When you buy a system you have to look at how much time you are spending on masking. If every job is a one board special, then you may be better off spraying on a coating. Ho
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