Electronics Forum | Wed May 21 13:26:46 EDT 2003 | Brian W.
Something else to keep in mind when you reflow using an IR (non-convection) oven. IR reflow is more susceptible to variations in board mass and coloration than convection ovens. Hi mass areas and dark colored parts will cause more variation in your
Electronics Forum | Tue May 20 11:09:30 EDT 2003 | JB
Hello Gav, We have tried the procedure that you described, and it didn't work well for us. Even though the viton tubing is doubled up and pinched, no amount of glue is visible at the tip of the tubing. So getting the glue to protrude from the syring
Electronics Forum | Fri Jul 04 01:32:15 EDT 2003 | rheise
I've seen numerous incidences of mirror image cracking under endcaps in high dielectric material ceramic capacitors due to thermal cycling. If the cracking is deep enough to extent through the plates you can get breakdown and shorting. Section the ca
Electronics Forum | Thu Jul 31 11:33:51 EDT 2003 | yngwie
I faced problem over connecter's pin that were hot air soldered. This connector has 168 pins ( similar to the straddle connector ). The process is to apply the flux onto the connector's J-leads, and the hot air pencil were then ran thru' the leads to
Electronics Forum | Thu Nov 06 07:54:50 EST 2003 | davef
First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance. Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA
Electronics Forum | Tue Mar 09 10:48:54 EST 2004 | cyber_wolf
I am not familiar with the VIP98, but I have worked with other BTU models for several years. As I have posted in earlier threads: there is absolutely no way to tell whether your profile is correct unless you attach thermo couples to your board and ru
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Fri Apr 30 22:45:59 EDT 2004 | Bryan She
we can test the defects with multimeter after reflow ,before ICT.and if we replace this damaged parts with good ones.everthing is ok.I'm sure this part is damaged during reflow,but why not other 19 same parts of the 20 on each board?we attach a therm
Electronics Forum | Tue May 18 22:12:52 EDT 2004 | Ken
I have considered using the same security methods employed at thousands of Gas stations across the USA. The bathroom key is attached to a large carburator, tire rim, or any 30 pound piece of towing chain! Seriously, I look at my processes and try a
Electronics Forum | Wed Jun 16 11:38:50 EDT 2004 | russ
Am I getting confused here? What about the the CBGA packages that we have been doing for 5-6 yrs? We never reflowed those balls since we couldn't due to the alloy. I have been informed that if you increase paste volume to ensure a full fillet aroun
