Electronics Forum | Wed Apr 26 02:16:18 EDT 2006 | AR
We had x-ray and optical microscopy analyses done on transformers dip soldered with Sn/Pb, SN100C3 and SN100C4 alloys using temperatures 400�C ... 450 �C, with dip times of 2..4 seconds. We found that SN100C4 is at least as good as Sn/Pb 62/38 and SN
Electronics Forum | Tue Dec 30 21:14:22 EST 2003 | davef
You're thinking correctly. 80Au20Sn is incompatible with: * Sn/Pb * In/Sn * Sn/Pb/In * Sn/Pb/Bi Contact your solder supplier to obtain pictures of IMC.
Electronics Forum | Thu Aug 16 19:58:49 EDT 2001 | davef
Just feel relieved that we didn't go to the matt on the use of "leaching" rather than "dissolution". And you thought this was easy, eh?
Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko
Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman
We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.
Electronics Forum | Thu Apr 18 14:00:35 EDT 2002 | Romain
Is anyone has experience on problems with press-fit on Ni/Au board finish. Connectors pins are SnPb finished. I am particulary interested by experiences or documentation in very agressive environmental conditions (avionics or space buisness) Thanks r
Electronics Forum | Tue Apr 04 12:44:08 EDT 2006 | Andrew
Anyone knows if there are some issues when you solder Silver finish components on Ni-Au finish pads with Sn/Pb/Ag solder paste (Indium)? (I must use components with silver finish) Thanks
Electronics Forum | Thu Aug 23 09:52:38 EDT 2007 | d0min0
Hi, in past we had an issue with ENIG surface, black was Ni that get pass the Au - but it was discovered after reflow (SnPb) and the IC was losing contact with Cu tracks...at customers application :| Reason was as I remember too thin Au sufrace... w
