Electronics Forum | Wed Sep 29 14:46:59 EDT 2004 | Bryan Smith, Micralyne
I am curious to hear feedback on whether companies that could benefit from a AuSn solder plating process would prefer to bring it inhouse (ie. License) or outsource the plating. I look forward to your comments. Bryan Smith Micralyne www.goldtinsold
Electronics Forum | Fri Oct 01 18:12:02 EDT 2004 | Bryan Smith
Hi Greg, You can find details on our AuSn solder plating at http://www.goldtinsolder.com. Call me at 780-431-4412 if you have questions. Take care, Bryan
Electronics Forum | Wed Sep 29 16:01:25 EDT 2004 | davef
Sure, if it is competitive with alternatives. Is it?
Electronics Forum | Sat Jan 30 21:04:32 EST 1999 | Sidharth
Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? partic
Electronics Forum | Fri Oct 01 18:07:46 EDT 2004 | Bryan Smith
Hello Dave, Yes, this is a patented commercial process in our MEMS Foundry and we are already working with several customers. I posted my question because we only recently have started widely promoting our AuSn plating services and we're still grasp
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Fri Dec 26 00:30:36 EST 2003 | Indy
hi, I wondering if anyone have any information on intermetallic growth in 80Au20Sn solder alloy. I have read that it has high reliability. Which bring an important question to my mind. What about Gold embrittlement ? Bye Indy
Electronics Forum | Tue Dec 30 21:14:22 EST 2003 | davef
You're thinking correctly. 80Au20Sn is incompatible with: * Sn/Pb * In/Sn * Sn/Pb/In * Sn/Pb/Bi Contact your solder supplier to obtain pictures of IMC.
Electronics Forum | Wed Sep 29 17:59:59 EDT 2004 | gregoryyork
I would be interested in this as well. Can you forward me some details. thanks Greg York Technical Sales Manager BLT Circuit Services Ltd - UK
Electronics Forum | Fri Jun 27 16:00:29 EDT 2014 | davef
For lid sealing, a seam seal machine will be used which produces only localized heat on the joint, so any components inside the package soldered with Au/Sn will be unaffected by the final process. [ http://www.coininginc.com/files/admin/english_gold_
.png)
