Electronics Forum | Fri Jan 08 02:27:00 EST 1999 | Kwang-Seong Choi
HI! I am a package engineer in Korea. I have some reasons to desolder excessive solder at the lead of TSOP and TSOJ after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. Does anyone know the
Electronics Forum | Fri Jan 08 15:02:38 EST 1999 | Dave F
| HI! I am a package engineer in Korea. I have some reasons | to desolder excessive solder at the lead of TSOP and TSOJ | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | Does anyone
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
Electronics Forum | Mon Sep 21 01:57:55 EDT 2009 | kaz
Hello All, My first visit here. I own and operate a small Industrial & Consumer Electronics Service Shop. There is more and more modules with high density fine pitch SMDs that we cannot handle. We bought PACE ThermoFlow BGA SMD station with a bunch o
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
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