Electronics Forum: automotive out (Page 1 of 3)

what software is out there that will extract XY centroid from gerber data?

Electronics Forum | Sat Feb 15 15:01:06 EST 2014 | dexter11233

At my company we have to capture centroid data from gerber information on almost a daily basis, so tinkering and toying with quicker and easier methods of getting the job done are fairly common place with us. As stated by Richard Larue UniSofts cad

QFN Packages

Electronics Forum | Mon Feb 28 12:01:30 EST 2005 | Bob R.

We use QFNs in automotive products and have done a good bit of experimenting with pad designs, paste patterns, stencil thickness, and thermal via patterns. All of them have an effect on assembly and thermal cycle reliability. There is not a yes or

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Thu Mar 16 03:45:51 EDT 2017 | rob

It's the same thermal issue whether it's a die or package. It's different if it is just a signal trace, but if it's a heatsink pad (LED, FET, Motor driver, PSU IC etc). I think the voiding issue boils down to what the part is actually doing. The or

Relying on AOI for sensor boards - EOL for functional test

Electronics Forum | Tue Jul 31 04:45:42 EDT 2018 | robl

Depends on what sort of outfit you are working for, and what you are building. A lot of CEMs are doing Flying Probe or ICT on the boards ahead of investing time building into units or adding parts that prevent access to rework. We have a combination

BGA underfill necessary with conformal coat?

Electronics Forum | Tue Apr 02 22:52:38 EST 2002 | davef

Tks BT Can't be many places tougher than automotive, 'cept maybe oil field, down pipe. We use Dexter Hysol flow underfills for both 1 thou and 3 thou gaps, but they wouldn't come close to filling under a BGA. Most BGA are sitting about 16+ thou fr

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 17:30:40 EDT 2007 | jmelson

Oh, for a second there I thought it was 257 C, not F. Solder temperature! Still, one WEEK at 257 F seems way extreme. Maybe this is to bake out a part that has been underwater for a week. Is this a military part? I can't imagine any commercial-g

I need PCBA test, how to choose ICT or AOI?

Electronics Forum | Thu Sep 23 01:46:57 EDT 2021 | auriga2001

Are you asking what manufacturer and type of machine to use for your production needs? It depends on the complexity of what you are making. Is it high quality for medical or military? Automotive? Commercial? How small are the components you typically

Help me to choose AOI-machine!

Electronics Forum | Tue Aug 27 04:32:45 EDT 2024 | BobbyWang

Having worked in the automotive industry and used machine from Kohyoung, SAKI, and parmi, while all three manufacturers offer high-quality machine, I've found that parmi stands out in terms of software stability and programming flexibility. Its nice

Handling PCB assy's

Electronics Forum | Thu Oct 31 16:40:01 EST 2002 | dragonslayr

Steve- I was once an auto body repairman in an automotive assembly plant. We used lead for dent filler instead of bondo. It was much faster to use. No cure time like a plastic filler needs. Lead was absorbed through my skin from hand filing the lead

Overprint, solder flow back

Electronics Forum | Wed Dec 06 08:29:50 EST 2006 | David

Hi Pavel, We regularly use over printing on a multitude of problem parts including fine pitch QFP's. In an Automotive Environment the only thing you can change without a mountain of paperwork is the stencil. best way to work out how much you can get

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