Electronics Forum | Thu Feb 10 08:25:02 EST 2005 | marakas
Could anyone advise what BGA rework rate we should expect with product that has 4 BGAs (224 pins, 196 pins, 160 pins, 48 pins). Negative factor is that we have old and tired pick & place - Panasonic MPA-G1 or MPA-V without AOI.
Electronics Forum | Fri Feb 11 02:42:17 EST 2005 | marakas
Thank you very much for your answer. We had: 1- 224 pins, size 19*19 mm, pitch 0.8 mm 4- 48 pins, size 11*7 mm, pitch 0.75 mm 1- 160 pins, size 15*15 mm, pitch 1 mm 1- 196 pins, size 15*15 mm, pitch 1 mm How many defects I should expect with th
Electronics Forum | Thu Feb 10 09:09:30 EST 2005 | russ
99% (there will always be that one that gets jacked somehow). Your old placement equipmment may affect this by dropped parts that get underneath the BGA, etc.. hopefully the placement accuracy will at least get the parts halfway on pad and they will
Electronics Forum | Tue Sep 17 17:55:36 EDT 2013 | dilogic
Yes, I know all that, but I am interested in some real figures from the field. That is, what percentage of mispicks do you experience on average (for large runs, of course)?
Electronics Forum | Wed Jun 19 15:28:58 EDT 2024 | davidk
Hi Tom, Thank you for your comment 75% FPY is also our target, cause we gonna have the AOIs in the SMT line. So you would expect more opportunities? I didn´t notice but there are not so many components with high opportunity rate. (the average numbe
Electronics Forum | Wed Oct 10 08:13:03 EDT 2007 | cyber_wolf
Hi, What is the expected reject rate for capacitors on a CP643 machine. I estimate that we are dumping around 1 in 20 on average. I have played around with lighting levels,vision types etc. Nozzles are in mint condition. Can anyone offer any advice
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Mon Mar 08 09:03:17 EST 2004 | russ
Is this problem really related to the size of the BGA OR the size/thickness of the PCB? Would I be correct in assuming that your pre-heater is small in size? Usually a board warps like this when the ramp is to great at the localized area. the imme
Electronics Forum | Sat Feb 05 14:51:49 EST 2005 | etienne
One important thing to look at, when buying an AOI is the False Calls Rate, along with tact time of machine to inspect the PCB. Obviously, many machines can do the the work....but it's also true that each machine differ from the way it do the work. S
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