Electronics Forum | Tue Jul 11 03:32:16 EDT 2000 | Charles Stringer
Can anybody advise where I can get the full SMEMA interface specification. I need to move about an old line and interface to Siemens Siplace which I understand is not true Smema - I have a spec for the Siplace interface - I now just need one for Smem
Electronics Forum | Sat Oct 06 16:51:24 EDT 2018 | reckless
Is there anything to watch out for when purchasing older AOI systems other than OS/Software? Specifically I am looking at older Mirtec/Marantz benchtop style units. I figure it's a good way to get my feet wet before going to a full inline system.
Electronics Forum | Wed Apr 14 14:28:32 EDT 2021 | lpbro
My first move is inspect the blades, swap the blades around and re-balance the blades to see if it is a problem that corresponds with a specific blade. Also try a different pair of blades. Full restart on the printer incase of an odd software problem
Electronics Forum | Tue Aug 21 03:36:41 EDT 2001 | Michael Ford
I would like to introduce you to our TIMMS system. This includes full multi-vendor programming and line balancing support, and can be used as part of an overall total solution for the shop-floor. The TIMMS (Totally Integrated Manufacturing System) i
Electronics Forum | Sun Mar 22 14:33:03 EST 1998 | Martin Plourde
| Two smd lines are available soon (1.6.1998) | Machines in lines are Fuji GL, GSP, CP and IP, also one machine from DEK and one from UNIVERSAL (SANYO) | Lines are currently in use. | If you are interested in two or one used smd-line please send a ma
Electronics Forum | Mon Dec 22 16:19:26 EST 1997 | Justin Medernach
| Need help determining the size / $ value of the stencil market | in North America. Can you offer suggestions as to who or where I can go to get a grasp on this data??????? | Thanks for any help. Dave, The market is huge. I work in the New England
Electronics Forum | Mon Mar 04 17:54:06 EST 2002 | davef
We do not use IPC 9850. �The stated purpose of IPC 9850 is �to standardize the way machine vendors specify placement rates with specific accuracy requirements for different components�. It also provides a form to record the test results, which inclu
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Tue Mar 04 17:47:19 EST 2003 | msivigny
Hello EW, thanks for your input, the data collection for measurements such as these can get confusing because you're calculating deviations from set point location to actual placement location and then analyzing the full result. Then there are many o
Electronics Forum | Sun Mar 23 00:09:02 EST 2003 | MA/NY DDave
Know the specs your assembly is supposed to meet 2>Runs some lot soldering samples to minimize cost if you do decide to scrap or bake or ?? 3>Do at least a little post soldering analysis to assure yourself that the results are similar to experien
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