Electronics Forum: b and board (Page 1 of 144)

6 layer board and routing bga package

Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer

Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g

PCBA board and probe

Electronics Forum | Sat Nov 13 03:10:36 EST 2021 | pti88

why poor contact between PCBA board and probe? When I used ICT to test PCBA board, there was poor contact between board and probe .

PCBA board and probe

Electronics Forum | Wed Nov 17 20:11:29 EST 2021 | dwl

is there flux on the board? are you probing a test point or a soldered pad? is the probe hitting the right spot?

PCBA board and probe

Electronics Forum | Sun Nov 14 11:14:50 EST 2021 | kylehunter

> why poor contact between PCBA board and probe? Why ask a question with 0 information and some how expect an answer?

Leaded and Lead Free BGA's on hte same board

Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick

CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn

Profiling board

Electronics Forum | Thu May 23 11:23:47 EDT 2002 | yngwie

Hi guys... Has anybody hv an experience with using a common or standard profile to reflow high mix brd ( say, low, medium and high )?. The reason for asking is that, we are running high mix low volume, and materials that were consigned is exactly as

SMT and TH board carrier

Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park

Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 13:04:35 EST 2001 | slthomas

We've got a problem with a fine pitch board that has about .005" registration error at each end (towards the center of the board) when it's printed. Apparently we've got a case of board stretch generated at the fab shop. I still have to do some mea

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 17:12:40 EST 2001 | slthomas

Thanks, Dave. Three courtesy cheers for specifications written to reflect the capabilities of the part suppliers, even if they fail to meet the purchaser's (not unreasonable) process req'ts. In the meantime, I'm sure my stencil guy would be more

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