Electronics Forum | Tue Dec 03 09:54:20 EST 2019 | davef
CURIOUS MINDS WANT TO KNOW Which processes are "front end" and which are "back end"? Why are they separated like that? Why are "front end" and "back end" processes usually done in separate plants? What are the high-value activities? Which activi
Electronics Forum | Wed Sep 21 05:33:34 EDT 2005 | Selva Govind
It's me again I post it before complete the message. Let me start once again. I plan, schedule and deliver SMT production programs for HMLV plant(app 1200 Assemblies). The kind of floor loading I have here is works great for SMT only. I'm considering
Electronics Forum | Tue Dec 05 08:39:22 EST 2000 | sean o'keeffe
i have a Staubli RX90 Cr robot on the back end of a small production line for automated systest and i need to source jaw grippers....any ideas where to look....... any help appreciated
Electronics Forum | Wed Feb 17 13:14:28 EST 1999 | Mark S.
Our company provides lead straightening (conditioning) services plus other related back-end services. Pls visit us on our website - www.chipro.com regards, Mark S.
Electronics Forum | Fri Sep 24 04:11:13 EDT 2004 | rob
Hi Chics, It all depends on where you are in the world - in Europe robots were used back end (Ericsson), and usually Fujis front end (Motorola, Nokia, Ericsson). In China you're obviously not going to need the Robots.... Cheers, Rob.
Electronics Forum | Wed May 23 12:51:25 EDT 2012 | deanm
Try trimming the leads to no more than 0.020" instead of 0.040" (1mm). The extra labor on the front end may save on the back end especially if almost all your boards have bridges in this area.
Electronics Forum | Fri Dec 03 19:20:36 EST 2021 | emeto
Titanium wall could go down to 10mil thickness. Just make sure this location runs on the back end of the pallet flow to avoid shadowing and allow solder to wet in this area.
Electronics Forum | Wed Feb 14 15:23:04 EST 2024 | mistrthou
There's a ton of spam accounts on the site. Probably gets cyber spammed on the back-end frequently. Not even sure if or how contacting a moderator is possible.
Electronics Forum | Thu Aug 06 14:58:40 EDT 2009 | davef
Semiconductor fab back-ends and production contractors use laser assisted solder jetting for protoyping, repair, and other low volume flip chip bumping. * As you say, printing paste is going to be very tough to control. * Solid ball placement is ai
