Electronics Forum | Tue Nov 03 06:23:12 EST 2009 | josh_brubaker
Has anyone ever done a tape test to see if the solder resist pulls away from the PCB? Is this an acceptable method for testing solder resist acceptability? This is an issue I am experiencing with our PCBs. I am receiving boards with excess solder o
Electronics Forum | Tue Oct 27 13:56:36 EDT 2009 | julie331975
I work for a CEM. We are having some quality issues with some pcb's that came from China. (I know, big surprise) Can anyone with pcb manufacturing experience look at some pictures I have and give me an opinion as to what could go wrong in the pcb man
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
Electronics Forum | Fri Sep 08 03:37:54 EDT 2017 | m_imtiaz
there any problem if Lead Free finish PCB being process using Leaded Solder Paste...? It is totally related to the manufacturing process and quality of joint, not to any specific compliance issues related to the European Union, China or any. Regards
Electronics Forum | Wed Feb 14 16:33:10 EST 2018 | cbart
nope!! i cant think of one!
Electronics Forum | Tue Jan 04 08:51:33 EST 2000 | g cronin
Comming into this new year I want to make sure I'm not overlooking anything in my process. I run a small contracting company, approx 20-25K PCB's per month. I am a firm beliver in finding people who know more than I do. So I am looking for anyone i
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
Electronics Forum | Thu Oct 26 10:29:03 EDT 2006 | Mike
First, Voiding under thermal pad is unavoidable(pardon the pun), unless you can find a way to add sufficient amount of solder paste to cover the area, and match that solder volume on your terminal leads. I build HVM qty's of "QFN" components w/ therm
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Wed Jul 06 15:29:01 EDT 2022 | glasscake
Also I should mention, I've ditched the formulas for getting the "optimal" solder amount after being bit by them once. Now I just design a PCB with 4-10 spots for the connector then order a stencil with a range of aperture sizes. Figure out what give
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