Electronics Forum | Fri Jul 22 07:36:18 EDT 2005 | Guest
It's the same like asking wether you get a gold-contaminated solder pot when soldering ENIG boards. As long as the replenishment of dross is large compared to the intake of contaminant, the contamination level will stay within acceptable levels.
Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris
0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to
Electronics Forum | Fri Jul 22 03:07:45 EDT 2005 | Joseph
Dear all, As we know there is a high risk of reliability issue due to lead contamination during mixture of NLF component at LF wave soldering process. But we have the following feed back from one of our customer as follow: Concerning the risk of m
Electronics Forum | Thu Sep 11 10:45:41 EDT 2008 | diesel_1t
Is just me, or too many "soldering issues" have been observed lately? on this forum... could be a ~90% components "backwards/compatible" in both leaded/lead free process?
Electronics Forum | Tue May 26 07:07:50 EDT 2009 | cyber_wolf
Grant, The Fuji's looked good. However, the pricing and warranty is not competitive for their comparable machine. In addition, we are not a big fan of Fuji coming out with new feeder designs that are not backwards compatible. The first generation of
Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish
Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?
Electronics Forum | Sat Dec 17 14:51:45 EST 2005 | Ola
"What worries me is that a lot of people speak about what they have heard, but there is no firm facts on exactly what the situation is." I do not understand this reply, because what can we do beside listening & read, unless we sometimes ourself do t
Electronics Forum | Sat Jun 04 01:39:39 EDT 2005 | adlsmt
It would appear that pure tin is backward compatible with leaded processes. This makes it a great finish, as if you migrate all your parts over time there is no issue mixing them. I am not aware of any finish that eliminates the possibility of tin wh
Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
.gif)
.png)
