Electronics Forum | Fri May 19 08:05:23 EDT 2000 | David
We do a lot of prototype work, builds occur days or months apart and moisture Absorption in IC's is a worry. I would like to bake, chuck in some silica gel and then seal or vac seal in an envelope. Does anyone have any experience of vacuum sealing wa
Electronics Forum | Tue Mar 07 13:21:03 EST 2000 | Tuan Bui
Hi John, Aerofeed,Inc. has the "Dry box" nitrogen cabinets. 215-257-1152 and they are in PA. I purchased one last year and it has been doing a wonderful job for our operations. I use it to store BGAs and micro BGAs after baking. To reduce the cost, I
Electronics Forum | Tue Jun 17 01:38:01 EDT 2003 | Dreamsniper
Hey fmonnette, What's wrong if I have a dry cabinet and baked all my components under 1-3%RH or say 5%RH regardless of their MS Level, whether they r level 4, 5, 5a, 6 etc.... What will be my problems in doing that process? just for curiosity, th
Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment
Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur
Electronics Forum | Mon Feb 28 17:16:38 EST 2000 | Stu Leech
We just got a lesson on the effectiveness of heat sealed metalized vapor barrier bags. A customer sent us two bags of 100% saturated PBG components by air freight. This was for a demoisturizing test. When we found the devices 80% dry when they arrive
Electronics Forum | Wed Feb 23 09:08:55 EST 2000 | Sal
Hey Guys, Thanks for the input and suggestions. Just been onto the adhesive manufacturer who reckons they should be no issue using a reflow profile for curing his adhesive , as long as the profile duration is not 6 minutes or over, which would bake
Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman
Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy
Electronics Forum | Tue Mar 20 09:03:18 EST 2001 | moseschee
Hi, I'm looking for research/study done on solder shelf life by using accelerated aging process ( steam age or dry air oven bake at 150C & etc ) Perhaps you could help to advise correlation of all this acceleration test to actual solder shelf life
Electronics Forum | Wed Jun 20 18:21:33 EDT 2001 | davep
What experience does anyone have with a MS level 6 SMT component? I have a part that must go from component baking to reflow within six hours. According to the component mfg, a sealed MS bag w/ desicant is not sufficient protection to increase the
Electronics Forum | Thu Jun 21 14:36:06 EDT 2001 | dason_c
DaveP, I never see the Level 6 component, can you describe what is the package look like, ie high pin count PBGA, component thickness? DaveF, if we can store the components in the dry environment say below 10%, can we stop the floor life clock after
