Electronics Forum | Mon Jun 28 15:03:43 EDT 2004 | jdumont
If you dont mind me asking, what are you guys using to keep your IC's dry??
Electronics Forum | Mon Jun 28 14:48:56 EDT 2004 | jdumont
Yes i was looking around that site this morning and found everything i needed. Thanks to all. Basically what im trying to do is justify the expenditure of a new NO2 generator for our IC cabinets. Ours died a little while back and we have been using
Electronics Forum | Sat Sep 26 22:08:07 EDT 1998 | Jeff Sanchez
I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info woul
Electronics Forum | Mon Sep 28 08:35:15 EDT 1998 | Earl Moon
| I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info
Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc
Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde
Electronics Forum | Mon Mar 05 22:37:49 EST 2007 | davef
Baking, IC tubes, metal * Perfection Products; 1320 S Indianapolis Ave, Lebanon IN 46052; 765-482-7786 fax 7792 http://www.perfection-products.com * Antistatic Industries; 130 Gamewell St POBox 460 Hackensack, NJ 07602-0460; 201-489-4400 fax 7654
Electronics Forum | Thu Jul 17 12:52:06 EDT 2008 | djd7554
We are baking the moisture out of our ic chips. They are on tape and reel. Can we bake them on tape and reel or do we have to put them in trays?
Electronics Forum | Mon Dec 28 12:33:58 EST 1998 | Brian Gurney
Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience.
Electronics Forum | Mon Apr 26 22:55:53 EDT 2004 | CT
Hi, I'm setting up a procedure for Moisture sensitive IC rework. Would like to understand what is the baking requirement for a board before a moisture sensitive IC can be remove from a board.
Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
