Electronics Forum: bake temperature (Page 1 of 25)

Humidity bake bends leads

Electronics Forum | Fri Apr 16 09:40:04 EDT 1999 | Gerry G

While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. I thought I'd ask some experts. Any help guys?

BGA bake out....

Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette

The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac

Re: Humidity bake bends leads

Electronics Forum | Sun Apr 18 03:58:26 EDT 1999 | P.L. Sorenson - Technical Consultant

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | To remove moisture from low quanti

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:02:39 EDT 1999 | Dave F

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Gerry: I imagine there could be s

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:52:39 EDT 1999 | Scott McKee

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Let me get this straight... He's

Re: Humidity bake bends leads

Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea

| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran

DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48

Newb needs to bake some chips help.....

Electronics Forum | Tue Jul 22 20:47:21 EDT 2008 | davef

Q1. Can I do this myself on site? A1. Sure. Most companies demoisturate their components in-house. Q2. Can we use our Vitronics Soltec XPM820 Reflow Oven? A2. You can. Most of us would be using an oven like that in our product processing. If you look

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef

There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si

discolored pbfree finish after bake and/or reflow

Electronics Forum | Fri Apr 21 09:03:59 EDT 2006 | choppy

I guess the first thing to look at is the temperature. We had to heat more for QFP256 on sample boards and we saw discoloration on some small parts. Just try to sense around when profiling to see what's there.

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