Electronics Forum | Fri Aug 10 07:33:32 EDT 2007 | davef
Tran Since we all agree that J-001 has no baking requirement, why are you baking the boards? What is the purpose of this bake process?
Electronics Forum | Fri Feb 01 16:14:55 EST 2008 | bghusker
We bake components in reels quite often using a low temp oven. If you look under JDEC standards they provide temps and baking times based off of the thickness of the part. The only problem with the low temp is that you could be looking at baking ti
Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef
Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get
Electronics Forum | Wed Jun 18 07:58:23 EDT 2008 | davef
Hi Stu Some seem to believe that vacuum baking will suck moisture from components and boards. Actually, the case is just the opposite. * Without proper definition and control of process parameters, vacuum baking retards the removal of moisture * Eve
Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Wed Apr 10 11:55:58 EDT 2002 | Yngwie
Temp/Humidity requirement for baking normally specified at : Low Temp baking : 40 deg C at 5% RH High temp Baking: 125 Deg C at 5% RH. The problem here is the 5% ? Although the 5% is achievable with a special Oven, can someone explain why is it 5%
Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef
We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake
Electronics Forum | Wed Dec 22 18:09:07 EST 2004 | kmorris
At a previous job I had been taught that when reflow soldering polyimide flex circuits, it was necessary to pre-bake them before reflow soldering to prevent delamination. Our procedures said that there must be a 1hr bake prior to reflow, and the flex
Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire
I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida
Electronics Forum | Fri Jul 30 16:43:28 EDT 1999 | Dreamsniper
Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce solder
