Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
Electronics Forum | Fri Jan 13 11:36:27 EST 2006 | stepheniii
If there is any other MSD's on it, yes. Otherwise, depends.
Electronics Forum | Fri Jan 13 08:59:29 EST 2006 | james
We built some boards with incorrect Bgas and we had to pull the bad ones off. I need to know if we need to bake the boards before we add the correct BGAs on and resend through the reflow? We need to get these boards shipped asap after we install th
Electronics Forum | Tue Sep 05 11:18:54 EDT 2000 | Chris May
Pascal, Hopefully, the system that you invest in will have a programmable drying cycle as one of its features. As far as humidity content is concerned, I am sure that some more learned colleagues may be able to help you. Although, I believe some p
Electronics Forum | Tue Jun 13 17:06:33 EDT 2000 | Jeff Tamagi
Someone was telling me that there was a requirement to bake / dry bare boards prior to reflowing? Where can I obtain information on this?
Electronics Forum | Sat Dec 19 16:54:43 EST 2009 | edmentzer
We use WSM-90 which is a red water wash off solder mask from Contronic Devices, Huntington Beach, CA, 714-897-2266. We bake the bare board at 150 F for 30 minutes after applying the mask. We run 130 to 140 F DI water in the inline cleaner which rem
Electronics Forum | Fri Aug 19 08:41:04 EDT 2005 | davef
If these are these bare [or partially assembled] boards, baking probably will not hurt, as long as the bake is not excessive. If these are these assembled boards, baking probably will not accomplish much. What is the source of this water? If it's
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Tue Nov 28 22:34:55 EST 2006 | davef
Almost all boards are hydroscopic. In this, the epoxy holding the board together absorbs moisture. Almost all components are hydroscopic. In this, the epoxy encapsulating the component together absorbs moisture. So, as you heat the board / compon
Electronics Forum | Tue Oct 27 16:22:00 EDT 2009 | davef
It's not the first thing we think of in looking at your picture. First off, the lack of copper in the region of the red oval makes us think of a plating defect. We don't expect that moisture out-gassing through the barrel wall to show-up on opposite
