Electronics Forum | Thu Feb 07 16:12:17 EST 2002 | Phil the Quality Guy
Recent discussions have risen lately regarding the in-house transferring and handling of populated printed circuit boards using unpainted wooden slats with notches cut in them. Wood may be at the high end of the neutral triboelectric scale but does
Electronics Forum | Thu Feb 07 20:55:09 EST 2002 | davef
You are correct about the location of wood on your friendly neighborhood triboelectric scale. But unfortunately for us [and fortunately for the ESD protected material board rack salesperson], the scale does not recognize the effect of the moisture t
Electronics Forum | Fri Feb 08 08:00:48 EST 2002 | caldon
Yet Again Dave spills his pearls of wisdom. Dave is correct in the moisture content wood absorbs. I know we have all visited factories with wood board holders and such. I have actually seen wood carts with drag chains. Also, keep in mind static can b
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
Electronics Forum | Thu Nov 01 01:48:14 EST 2001 | hamos_wks
168hrs, 1week of storage and frequently applied for rework after testing.
Electronics Forum | Thu Nov 01 00:32:14 EST 2001 | ianchan
we bake boards 80~120 deg-C @1hr, after in-line DI wash. oven setting to 90 deg-C, as +/-5 deg-C, tolerance against door open/shut fluctuations = "temperature loss". If anyone has evidenced procedure, that shows no need for baking, pray do share wi
Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker
I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O
Electronics Forum | Mon May 27 12:24:21 EDT 2002 | arcandspark
Carol, I beleive there is an IPC spec for Moisture control. We see all kinds of problems with boards coming from the vendors. We use to bake all bare fabs upon recieving them. This helped alot but waste time. We now rely on the board vendors to bake
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
