Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef
Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get
Electronics Forum | Wed May 09 11:40:28 EDT 2012 | gnus
Teaching trays (considering you already have the package in your library) takes about 2 mins. Really comes in handy for small batches when ICs/BGAs are supplied in small strips.
Electronics Forum | Fri Feb 01 11:38:10 EST 2008 | operator
I have never had this come up before. We have a customer that would like all their BGAs baked before production. No a problem, but one of them is in tape and reel. I don't know the temperature limits of tape and reel. Has anyone done this and at what
Electronics Forum | Wed Jan 03 01:51:23 EST 2018 | grek
Hello, i would like to ask if there is any differencies when baking components in baker with control huminidity 5% or when baking components in vacuum? is it ok ? or it should not be baked in vacuum? And one more question: Is it possible to bake tr
Electronics Forum | Fri Feb 01 16:11:08 EST 2008 | operator
They have been having a lot of fallout and they believe it is one of the BGAs that is causing it. I tell all my customers that it is better to stay away from baking if possible and to practice proper storage techniques. But the thing is they insist o
Electronics Forum | Thu Dec 19 11:30:11 EST 2002 | russ
What temp. are you planning on baking them? If this is long term process I would recommend that you hav trays made out of an appropriate ESDS material that can withstand your bake temp (such as duropol)for your QFPs. You can have several patterns/pa
Electronics Forum | Tue Sep 14 07:54:05 EDT 2004 | modwyer
Folks, At the moment I bake all BGA that are in unsealed trays, to reduce moisture etc. Is this common practice or are there particular manufacturuers that cause more problems. Also, the tape for BGA tape & reel has a hole in the tape (as is normal
Electronics Forum | Thu Jul 17 13:57:21 EDT 2008 | dphilbrick
The recommended bake temperature for components in Tape and Reel is 40C. If you use a bake temperature higher than that, the cover tape and other elements of the packaging will degrade to the point that it becomes impossible to reliably use an automa
Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko
3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se
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