Electronics Forum | Mon Dec 31 05:14:58 EST 2001 | ronih
Hello, Are there any rules for PCB drying (baking) before assembly; Date code criteria, finish process on PCB, storage conditions.. ect. I know some assemblers that are baking all PCB (not ENTEK!) as default before assembly, is it realy nessesary? i
Electronics Forum | Wed Aug 08 17:26:40 EDT 2007 | htran
Hello All, I have been searching for the board assemblies bake out requirements acceptance criteria but unsuccessful. Does anyone knows if there are general guidelines for the percentage of the moisture absorption in the PWBs and PWAs? Thanks, Tran
Electronics Forum | Mon Mar 08 22:04:19 EST 2004 | pari
Dave i know abt the JEDEC033A specs..but this question is more of PCBA level. The baking temp and time at JEDEC is for MSD devices. I have tried to check IPC 7711 but the criteria does not mention the baking temp and time. Wandering is anyone is awar
Electronics Forum | Wed Nov 29 01:46:10 EST 2006 | hanocete
Hi! to all, Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our cr
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Thu Jul 21 16:05:24 EDT 2005 | russ
This is kind of odd, I am accustomed to the Q.C. dept. verifying that criterias/specs have been met per engineering and contractual requirements and not identifying or implementing these specs. I believe that this philosophy aids in eliminating the "
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
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