Electronics Forum | Thu Sep 12 11:50:58 EDT 2002 | stepheno
http://www.jedec.org/download/search/jstd020b.pdf http://www.jedec.org/download/search/jstd033a.pdf The above links are for JEDEC standards regarding moisture sensitivity. SMT magazine has an article a few months ago regarding a company that saved
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen
Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala
If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and
Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef
Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get
Electronics Forum | Wed Jan 03 01:51:23 EST 2018 | grek
Hello, i would like to ask if there is any differencies when baking components in baker with control huminidity 5% or when baking components in vacuum? is it ok ? or it should not be baked in vacuum? And one more question: Is it possible to bake tr
Electronics Forum | Mon Nov 26 17:42:24 EST 2001 | davef
I agree. Voids in plating are bad news and baking will not change that.
Electronics Forum | Fri Feb 01 16:14:55 EST 2008 | bghusker
We bake components in reels quite often using a low temp oven. If you look under JDEC standards they provide temps and baking times based off of the thickness of the part. The only problem with the low temp is that you could be looking at baking ti
Electronics Forum | Thu Mar 01 12:27:29 EST 2007 | jdumont
Is anyone doing this? What is the proper temp to bake tubes at? Is there an easier solution? Thanks in advance
