Electronics Forum: baking out mositure (Page 6 of 41)

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne

Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle

Re: Component Baking

Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn

| | Does anyone know about low pressure/low temperature | | ovens used for baking of moisture senstive | | components? | | Thanks | I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera

Voids in every Lead-free BGA solder Joint

Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW

What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and

Re: Component Baking

Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon

| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a

To bake or not to bake?

Electronics Forum | Sat Sep 26 22:08:07 EDT 1998 | Jeff Sanchez

I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info woul

BGA Baking in Reels?

Electronics Forum | Wed Feb 06 17:28:27 EST 2008 | blnorman

We have some components on a reel that are 2.3 mm in thickness and need to be baked out. The reel has a warning not to exceed 50�C. According to J-STD-33, the proper bake out is 67 days @ 40�C.

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Fri Feb 09 09:42:33 EST 2018 | jmedernach

I completely agree. J-STD-033 spells out the "how to" of baking, quite clearly. You have to bake something for an expensively long time at 80 - 85C in order to properly desiccate your components.

Baking PWBs prior to wave solder

Electronics Forum | Mon Dec 16 15:00:56 EST 2002 | sueph

We have always baked our assembled boards prior to wave solder, but have recently learned that there are some companies out there who don't. I checked with one of my supervisors, and he said that baking is recommended but not required. I'm wonderin

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so

Baking PWBs prior to wave solder

Electronics Forum | Mon Dec 16 15:38:17 EST 2002 | Randy Villeneuve

No parts or boards are baked unless they are moisture sensitive and were left out too long and that is for reflow only. In your case there should be no reason to bake becouse the boards should be vacuum packed as they come in as well as any moisture


baking out mositure searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Software for SMT

We offer SMT Nozzles, feeders and spare parts globally. Find out more
Best SMT Reflow Oven

High Precision Fluid Dispensers
pressure curing ovens

High Throughput Reflow Oven
Assembly Automation Technology

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...