Electronics Forum: baking out mositure (Page 7 of 40)

Baking SMT Components

Electronics Forum | Thu Jul 17 12:52:06 EDT 2008 | djd7554

We are baking the moisture out of our ic chips. They are on tape and reel. Can we bake them on tape and reel or do we have to put them in trays?

PCB BAKING

Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef

IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components

MSD Baking

Electronics Forum | Fri Feb 10 13:30:31 EST 2023 | rwyman

Yes, that point remains unchanged. Just a general comment that there have been updates. e.g. re: desiccant re-use, certain devices no longer requiring bake-out, or bake times have been adjusted, and more.

Re: Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 14:37:06 EST 2000 | Chris

I should explain that this bake out was performed after population. The solder paste slumped terribly after this bake out. However, after the back out and after reflow, no bridging.

Gold Contacts

Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC

Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.

Water Washing

Electronics Forum | Mon Jan 04 21:03:22 EST 2010 | cman

1) I'm not familiar with the acronym CAF. Could you spell that one out for me? 2)Why do you feel they need to be baked? Are they in a high humidity enviornment? the only time we bake is when we are dealing with moisture sensitive components. Do you b

Baking time for PCBA rework

Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef

Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica

Re: Component Baking

Electronics Forum | Fri May 22 15:45:31 EDT 1998 | Justin Medernach

| Does anyone know about low pressure/low temperature | ovens used for baking of moisture senstive | components? | Thanks Mike, Check out the people at 3M. They have come out with high temp reels and carriers that can withstand a bake. Try the gu

Re: Help... Need new or used SOIC-16 metal tubes - Do You Really??

Electronics Forum | Tue May 05 15:45:37 EDT 1998 | Dave F

| Looking to buy used or new tubes, that will fit an SOIC-16 | Need these tubes ASAP. We need to bake these parts and drypack. | Please email or call if you can help. | Eric Jenkins | 801 956-0897 Eric I'm not sure of the manufacturer of the parts th

Baking for delam prevention

Electronics Forum | Wed Nov 09 10:02:42 EST 2005 | Tim

You should be baking above 100C/212F to ensure that you're driving moisture out of the board. Four hours at 225F is usually enough to dry out most multilayer PWBs.


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