Electronics Forum: baking parts twice (Page 1 of 41)

component baking

Electronics Forum | Sat Aug 17 08:59:11 EDT 2002 | davef

Clarifying: 1. About 2% of part numbers have a moisture problem

component baking

Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss

Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the

Micro BGA baking

Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette

Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes

PCB baking for rework

Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs

We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to

Micro BGA baking

Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef

Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen

baking boards, revisited

Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef

We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes

Bare PCB baking

Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas

The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep

I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 17:30:40 EDT 2007 | jmelson

Oh, for a second there I thought it was 257 C, not F. Solder temperature! Still, one WEEK at 257 F seems way extreme. Maybe this is to bake out a part that has been underwater for a week. Is this a military part? I can't imagine any commercial-g

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