Electronics Forum | Mon Nov 04 07:27:33 EST 2019 | amitthepcbguy
There are multiple methods where you can perform top and bottom reflow soldering simultaneously. With this method, you might not worry about the type of flux there is. Each part is covered and baked as per the requirement, while making sure there are
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Thu Jan 31 13:19:28 EST 2002 | dason_c
What is the baking time/temperature standard for the PCBA before BGA rework?
Electronics Forum | Sat Dec 19 04:51:49 EST 2015 | padawanlinuxero
bake the pcba, continue with the aqueous cleaning but after the cleaning bake them in a circulated oven. we do that with some of our pcbs here we use a water base flux, we clean it and then we bake them for 10 minutes at 190F
Electronics Forum | Wed Mar 02 13:15:16 EST 2022 | chris007
I am currently working on a manufacturing flow where some PCBA are processed with reflow oven (after being baked before processing), then cleaned with bath, then passed into contaminometer, passed into AOI. The point is after all of this, if AOI dete
Electronics Forum | Tue Apr 23 16:46:14 EDT 2002 | retronix
I would sugest the lowere the baking temperature the better, the main cause of popcorning is the water expansion and this is greatest as the water boils, 100 degrees, better to elongate the time. Matt
Electronics Forum | Mon Mar 08 22:04:19 EST 2004 | pari
Dave i know abt the JEDEC033A specs..but this question is more of PCBA level. The baking temp and time at JEDEC is for MSD devices. I have tried to check IPC 7711 but the criteria does not mention the baking temp and time. Wandering is anyone is awar
Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
