Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Thu Jul 21 08:24:28 EDT 2005 | dougs
are you going to clean the boards prior to coating?
Electronics Forum | Wed Jul 20 10:07:05 EDT 2005 | cecil
Does anyone have any input on the need to bake out an assembly prior to the conformal coat process? I understand baking out components/pwb's prior to processing through the reflow or wave solder process if the material shows excess moisture absorbtio
Electronics Forum | Wed Jul 20 15:33:38 EDT 2005 | cecil
QC dept. refrain from giving direction!! Geez have I died and gone to heaven?
Electronics Forum | Mon Aug 01 18:50:46 EDT 2005 | crishan
Hi Cecil, We using conformal coating in our manufacturing area, we did use to use Humiseal, others have been Bectron and Peters. We recentalt switched all lacquering to Peters, since it is lead free and it is a lot friendly than Humiseal. To answer
Electronics Forum | Thu Jul 21 14:16:56 EDT 2005 | stepheniii
Tell them every action taken with the boards carries risk of damage. Process steps that don't do anything should be avoided because they carry the risk of causing defects. Even inspection causes the occasional defect, and board handling in general s
Electronics Forum | Thu Jul 21 14:42:47 EDT 2005 | jdengler
Stephen, If you have ever gotten QC to buy into this logic you have a much better QC department than most. Jerry
Electronics Forum | Wed Jul 20 15:18:35 EDT 2005 | FW
Hi! We have both Dip & Spray conformal coating processes & have never done any kind of baking before the process! I am assuming the reason for baking would be the same - ie, remove any moisture on the brds since moisture will create failure of the co
Electronics Forum | Thu Jul 21 16:05:24 EDT 2005 | russ
This is kind of odd, I am accustomed to the Q.C. dept. verifying that criterias/specs have been met per engineering and contractual requirements and not identifying or implementing these specs. I believe that this philosophy aids in eliminating the "
