Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Tue Oct 31 01:32:47 EST 2006 | hanocete
thanks for your reply, actually we bake the PCB assembly prior the rework because the package was exposed for quite some time already. The baking time was 24hrs @ 125 deg.C. We notice that there were flux residues on the connectors after the baking.
Electronics Forum | Mon Oct 30 21:00:31 EST 2006 | hanocete
thanks for your inputs,but what i meant was that a connector component beside the BGA for repair has some flux residue on its leads after baking, the BGA was Ok. we are wondering why this happened...pls enlightened us.
Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete
We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl
Electronics Forum | Mon Oct 30 21:43:08 EST 2006 | davef
So, after the repair of a BGA, you notice white reside on a nearby connector. Correct? [Sorry we're so dense. Long day.] Tell us about: * Flux class used in repair * Flux class used in original assembly Why are you baking the assembly after repair
Electronics Forum | Mon Oct 30 20:24:35 EST 2006 | davef
As we understand it, you: * Get some nice BGA from your supplier * Find BGA to be packaged properly * Bake the BGA for 24 hours at [what temperature?] to reduce the potntial for damaging moisture sensitive components during following processes * Remo
Electronics Forum | Tue Oct 31 21:49:38 EST 2006 | davef
First, we assume the white residue is only on the connector and not on other components. That would imply that either: * White stuff was on the connector when it came in-house from your supplier. [Confirm this theory by baking some connectors from
Electronics Forum | Wed Sep 15 17:53:53 EDT 2004 | aaronrobinson
My question is how does heat alone (125DegC for 48hours) diffuse the water vapour in a component, I figure the amount of water vapour in grams per cubic cm will be the same regardless of temp...yes with temp the RH changes but once the component rea
Electronics Forum | Thu Nov 01 00:32:14 EST 2001 | ianchan
we bake boards 80~120 deg-C @1hr, after in-line DI wash. oven setting to 90 deg-C, as +/-5 deg-C, tolerance against door open/shut fluctuations = "temperature loss". If anyone has evidenced procedure, that shows no need for baking, pray do share wi
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
