Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Sat Aug 17 08:59:11 EDT 2002 | davef
Clarifying: 1. About 2% of part numbers have a moisture problem
Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss
Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the
Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen
Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG
Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs
We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to
Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef
Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen
Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef
We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Thu Aug 04 22:02:25 EDT 2011 | fujiphil
IP3 camera calibration, you need the following: 1. Part camera resolution Jig. 2. 10mm nozzle for nozzle centering. 3. Button jig (skip). 4. Glass board and Glass parts. 1. Conduct the Camera resolution. Set the following Delta values: X=+/-0.1mm;
