Electronics Forum: baking reel parts (Page 2 of 90)

component baking

Electronics Forum | Sat Aug 17 08:59:11 EDT 2002 | davef

Clarifying: 1. About 2% of part numbers have a moisture problem

component baking

Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss

Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the

parts left on a reel

Electronics Forum | Mon Aug 20 14:39:42 EDT 2012 | davef

Investigate these links * http://www.ehow.com/how_12128475_determine-number-parts-partial-reel.html * http://ox3.com/pprX.php

parts left on a reel

Electronics Forum | Mon Aug 20 07:17:36 EDT 2012 | ericrr

Hi we have Juki KE-750L's is there any program to work out how many parts left on the reel, on the machine, the placement program does have a option to keep this number, but once you finish the run and start a new run the figure is lost. Unless I mis

parts left on a reel

Electronics Forum | Wed Aug 22 07:24:34 EDT 2012 | ericrr

how about this for resistor & capactors with 4mm pitch, all measurements in millimeters. cell A1 "Input inside diameter" answer in cell B1 cell A2 "Input outside diameter"answer in cell B2 cell A3 "Input layer width,(from inner to outside layer) (no

parts left on a reel

Electronics Forum | Tue Sep 18 10:52:14 EDT 2012 | sarason

Sounds like a plan. The usual way is to count how many you use on the job either by pre-calculation. Or how many clicks the machine counts and save the data before switch off, then drop it back into a spread sheet. This depends very much on the mach

Micro BGA baking

Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen

Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG

PCB baking for rework

Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette

The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release

PCB baking for rework

Electronics Forum | Tue Jul 16 01:12:31 EDT 2002 | ppcbs

We find that baking PCB assemblies at 90 degrees C in a Blue M forced air oven is safe for most all PCB's that we have encountered over the past 12 years. We remove any external plactic hardware that may be attached to the assembly and also like to

Micro BGA baking

Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef

Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen


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