Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef
We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Mon Jul 04 05:41:24 EDT 2016 | slouis2014
Can anybody advise what temperature can a BGA component on reel be bake and how long.
Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef
IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]
Electronics Forum | Fri Aug 24 17:30:40 EDT 2007 | jmelson
Oh, for a second there I thought it was 257 C, not F. Solder temperature! Still, one WEEK at 257 F seems way extreme. Maybe this is to bake out a part that has been underwater for a week. Is this a military part? I can't imagine any commercial-g
Electronics Forum | Tue Mar 30 10:43:21 EST 2004 | Robert
I could use some help too. I have a bunch of SMD 4 Pads Inductors from Central Technologies. The dimensions of the part is 11.30x13.9x6.9 . I've called four companies already and none were able to find a carrier for this part. These parts are on plas
Electronics Forum | Mon Sep 16 12:55:27 EDT 2002 | davef
We send parts out to be tape & reeled. We do not send all loose parts out to be tape & reeled. As you would expect, we base our decision on: * T&R service company lead time * Our production schedule * Cost benefit of T&R versus some other productio
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Wed Oct 10 13:35:00 EDT 2001 | stepheno
I used to work with Chris. (neither of us are there anymore). What is he talking about is putting components into "pockets". The parts would come in, in sticks (tubes) but we wanted them in reels. At first we sent them out to be reeled, but that w
