Electronics Forum: baking reel parts (Page 3 of 90)

baking boards, revisited

Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef

We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes

Bare PCB baking

Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas

The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Baking BGA on reel

Electronics Forum | Mon Jul 04 05:41:24 EDT 2016 | slouis2014

Can anybody advise what temperature can a BGA component on reel be bake and how long.

Baking BGA on reel

Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef

IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]

Moisture Sensitive part - baking

Electronics Forum | Fri Aug 24 17:30:40 EDT 2007 | jmelson

Oh, for a second there I thought it was 257 C, not F. Solder temperature! Still, one WEEK at 257 F seems way extreme. Maybe this is to bake out a part that has been underwater for a week. Is this a military part? I can't imagine any commercial-g

PCBA baking prior to rework

Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg

In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br

PCBA baking prior to rework

Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef

1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)

Moisture Sensitive part - baking

Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman

According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t

tape and reel vendor

Electronics Forum | Tue Mar 30 10:43:21 EST 2004 | Robert

I could use some help too. I have a bunch of SMD 4 Pads Inductors from Central Technologies. The dimensions of the part is 11.30x13.9x6.9 . I've called four companies already and none were able to find a carrier for this part. These parts are on plas


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