Electronics Forum | Wed Jul 11 22:44:50 EDT 2012 | joeion
Why cannot reply????
Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion
It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.
Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier
Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar
Electronics Forum | Thu Jul 05 21:07:09 EDT 2012 | davef
Probably they had a problem with a certain product, tried baking, the problem went away and ever since there stuck with this money loosing process. So, ... * Write up a plan to split a couple of batches, bake a portion of each batch, don't bake the o
Electronics Forum | Fri Jul 06 10:35:32 EDT 2012 | ashworth14
All i used to do was blow them with an airline to remove the excess moisture then bake them for 15/20 min at 100' in an oven and that seems to work fine, i did get the info from a 4 stage cleaning guide for the actual cleaning solution we used but it
Electronics Forum | Fri Jul 13 08:03:54 EDT 2012 | cobham1
I appreciate all the feedback. The reason I was asking the question is because we have an internal documnet that states we need to bake for 16 hours after the boards are cleaned. This just seemed to long for what little moisture is really removed. I
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1
I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r
Electronics Forum | Fri Jul 06 05:28:59 EDT 2012 | jsolloway
..... that's very strange. If there were any risk of de-lamination then it would of occurred during the reflow process, surely. Unless the through hole department are using heat guns or wave sodler? I doubt if the sales or planning team are happy if
Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru
What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl
