Electronics Forum: baking temperature (Page 10 of 25)

MSD classification

Electronics Forum | Mon Mar 22 07:35:41 EST 2004 | Chris Lampron

We too are baking required components at 125 degrees C. One of the problems that is comming up is components packaged in tubes. The tubes cannot stand the 125 degree requirement without melting. 50 degrees is a safe temperature for low temp carriers

Re: Handling of Moisture sensitive devices

Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F

Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow

Re: Baking FR-4 PWB's prior to reflow

Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc

Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:52:39 EDT 1999 | Scott McKee

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Let me get this straight... He's

Baking for delam prevention

Electronics Forum | Thu Oct 27 11:45:06 EDT 2005 | Jeffm

I have a multi layer (8) PWB with blind vias going from 1 to 7 that is experiencing occasional blistering (delam). It is only on perhaps 15% of the boards run. We vacuum baked (85C, not sure what pressure) a sample lot and still had a few exhibit the

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman

Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy

SMT Disasters

Electronics Forum | Mon Jul 07 09:00:50 EDT 2008 | josh_brubaker

These images are of two melted matrix trays, full of BGA components, which were left to bake in an oven over the weekend. The oven temperature controller was not checked after a recent power failure and reached a temperature of 715�F. The two trays m

Re: Component Baking

Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon

| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a

outgasing (silver-glass)

Electronics Forum | Wed Oct 14 04:01:28 EDT 1998 | Joakim Fagerlund

We have problems with achiveing a void free soldered joint when we seal different kind of packages (QFP,LCC and PGA) We think the problem partly is due to outgasing from the die-adhesive (silver-glass) Does anybody have any reccomendations what to d

Re: Humidity bake bends leads

Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea

| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co


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