Electronics Forum | Mon Sep 11 00:31:13 EDT 2000 | rcsantos
Is there somebody who knows if there is a machine already available in market that can transfer die from wafer to waffle tray. This machine should a stand alone type or can be integrated to some P&P machine. What I'm trying to say is just like the on
Electronics Forum | Thu Sep 12 11:50:58 EDT 2002 | stepheno
http://www.jedec.org/download/search/jstd020b.pdf http://www.jedec.org/download/search/jstd033a.pdf The above links are for JEDEC standards regarding moisture sensitivity. SMT magazine has an article a few months ago regarding a company that saved
Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen
Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Wed Jan 09 14:05:58 EST 2008 | edmneb
We recently acquired a Siemens Siplace F3 and a S15 machine, and I am having a few problems with the machines. We have always been a Universal shop, so I am not really familiar with the Siplace machines, and need some help from all of you folks out
Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala
If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and
Electronics Forum | Fri Feb 23 08:56:21 EST 2007 | russ
I persoanlly have noticed issue with either method, only time I run into issues with trays is when they get baked at too high of temp and warp. Russ
Electronics Forum | Mon Mar 05 04:25:09 EST 2001 | genglish
Hi, SMTnetters � Does anyone have any information on waffle trays, is there an IPC guideline for the use of these? I am experiencing a universal GSM dumping trays with parts still in the trays and I suspect the tray data will require amending if the
Electronics Forum | Fri May 19 08:05:23 EDT 2000 | David
We do a lot of prototype work, builds occur days or months apart and moisture Absorption in IC's is a worry. I would like to bake, chuck in some silica gel and then seal or vac seal in an envelope. Does anyone have any experience of vacuum sealing wa
