Electronics Forum | Sat Sep 10 17:12:18 EDT 2022 | yannick_herzog
Hello, we use an oven to dry our MSL components after the floor lifes expires. The oven works at 40°C / 0.1% RH. The plan is to upgrade the oven from 40°C to 60°C to shorten the duration of the process. I have found a number of articles mentioning
Electronics Forum | Tue Jun 17 12:57:26 EDT 2008 | sleech
You are correct. For the 70 deg. C drying temperature to be effective, the relative humidity must be as near to zero as possible. A pulling a vacuum on the chamber is an inexprensive and reliable way to accomplish this. Contrary to some claims, our e
Electronics Forum | Tue Jul 22 20:47:21 EDT 2008 | davef
Q1. Can I do this myself on site? A1. Sure. Most companies demoisturate their components in-house. Q2. Can we use our Vitronics Soltec XPM820 Reflow Oven? A2. You can. Most of us would be using an oven like that in our product processing. If you look
Electronics Forum | Mon Jan 15 15:33:41 EST 2001 | davef
First, we have never repackage devices, as you propose. Our schedule has us standing at Receiving like panting dogs waiting for the material required to jump the job, much less giving up the time and money to have parts repackaged. Second, fabricat
Electronics Forum | Tue Feb 17 10:08:17 EST 2004 | russ
Do you have a bake oven that will reach 200C? You could bring a batch of boards up to temp and then start the pluckin'. A sfar as the solder goes if you apply flux to the leads they remove very clean as far as solder goes. To remove the flux we pl
Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc
There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik
Electronics Forum | Wed Mar 17 19:57:08 EST 2004 | Dreamsniper
Do you wanna save the BGA or what? Do you have an electric stove, baking tray and a BBQ clip? Does your wife love cooking? if u have one of each, then u don't need a reflow oven which is too expensive and you don't need to buy heating guns or drill p
Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont
We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte
Electronics Forum | Mon Nov 20 11:58:16 EST 2006 | Rob
We try and do it all (Vac pack, dessicant, indicator card, MSL level, PBT, end termination material etc.) however it throws a spanner in the works if you pull a manufacturer's sealed pack from stock and the vacuum has gone where an edge of a tray has
Electronics Forum | Thu Jul 19 18:15:15 EDT 2012 | jil2000
We have a material that is been stick at cover tape, only 1 supplier is failing and only embossed tape packing is failing. A dark spots between tape and component are observed, we already bake material to se if is humidity, is not. We already apply
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